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UK funding (562 873 £) : Intégration de circuits RF avec commutation GaN à grande vitesse sur des substrats de silicium Ukri01/07/2016 UK Research and Innovation, Royaume Uni

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Texte

Intégration de circuits RF avec commutation GaN à grande vitesse sur des substrats de silicium

Abstract Future generation (5G) mobile phones and other portable devices will need to transfer data at a much higher rate than at present in order to accommodate an increase in the number of users, the employment of multi-band and multi-channel operation, the projected dramatic increase in wireless information exchange such as with high definition video and the large increase in connectivity where many devices will be connected to other devices (called "The Internet of Things"). This places big challenges on the performance of base stations in terms of fidelity of the signal and improved energy efficiency since energy usage could increase in line with the amount of data transfer. To meet the predicted massive increase in capacity there will be a reduced reliance on large coverage base-stations, with small-cell base-stations (operating at lower power levels) becoming much more common. In addition to the challenges mentioned above, small cells will demand a larger number of low cost systems. To meet these challenges this proposal aims to use electronic devices made from gallium nitride (GaN) which has the desirable property of being able to operate at very high frequencies (for high data transfer rates) and in a very efficient manner to reduce the projected energy usage. To maintain the high frequency capability of these devices, circuits will be integrated into a single circuit to reduce the slowing effects of stray inductances and capacitances. Additionally these integrated circuits will be manufactured on large area silicon substrates which will reduce the system unit cost significantly. The proposed high levels of integration using GaN devices as the basic building block and combining microwave and switching technologies have never been attempted before and requires a multi-disciplinary team with complementary specialist expertise. The proposed consortium brings together the leading UK groups with expertise in GaN crystal growth (Cambridge), device design and fabrication (Sheffield), high frequency circuit design and fabrication (Glasgow), variable power supply design (Manchester) and high frequency characterisation and power amplifier design (Cardiff). Before designing and developing the technology for fabricating the integrated systems to demonstrate the viability of the proposed solutions, a deep scientific understanding is required into how the quality of the GaN crystals on silicon substrates affect the operation of the devices. In summary, the powerful grouping within the project will bring together the expertise to design and produce the novel integrated circuits and systems to meet the demanding objectives of this research proposal.
Category Research Grant
Reference EP/N016408/1
Status Closed
Funded period start 01/07/2016
Funded period end 30/06/2021
Funded value £562 873,00
Source https://gtr.ukri.org/projects?ref=EP%2FN016408%2F1

Participating Organisations

CARDIFF UNIVERSITY
NXP Semiconductors
Rohde & Schwarz UK Limited
Kelvin Nanotechnology Ltd
Plessey Semiconductors Ltd
M/A Com Technology Solutions (UK) Ltd
Diamond Microwave Devices Ltd
DSTL Porton Down
Oxford Instruments Group (UK)
IQE PLC
European Space Agency
Arelis - Thomson Broadcast

Cette annonce se réfère à une date antérieure et ne reflète pas nécessairement l’état actuel. L’état actuel est présenté à la page suivante : Cardiff University, Cardiff, Royaume Uni.