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Financement de l’UE (7 269 829 €) : Tolérance aux environnements difficiles Systèmes intelligents pour l’IoT et l’IA Hor01/06/2020 Programme de recherche et d'innovation de l'UE « Horizon »

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Tolérance aux environnements difficiles Systèmes intelligents pour l’IoT et l’IA

Digitalization has been identified as one of the key enablers for renewal and competitiveness of European manufacturing industries. However, grasping the digitalization and IoT-related opportunities can be limited by the harsh environmental conditions of the manufacturing processes and end use environments. The ECSEL-IA 2019 project initiative CHARM aims to contribute to solving this problem by developing ECS technologies that tolerate harsh industrial environments. The project concept centres around real industrial challenges from different types of end use industries. The synergies and impacts arise from similarities in technology solutions serving different applications and industry sectors. The CHARM Use Cases include six different industry sectors, majority of them presented by innovative cutting-edge large enterprises that belong to the world-wide market leaders of their own sectors – while most of them being new to the ECSEL ecosystem: mining (Sandvik Mining and Construction Oy, FI), paper mills (Valmet Technologies Oy, FI), machining (Tornos SA, CH), solar panel manufacturing lines (Applied Materials Italia SRL, IT), nuclear power plants maintenance and decommissioning (ÚJV Řež a.s., CZ), and professional digital printing (Océ-Technologies B.V, NL). The planned demonstrators engage these big players with European ECS value chains and showcase capabilities that serve manufacturing industries’ needs at large. The new technologies to be developed include novel multi-gas sensors, robust high temperature and pressure sensors, flexible sensors for paper machine rolls, wireless power transfer systems, connectivity solutions for rotating parts, advanced vision systems, and enablers for autonomous driving. The project consortium includes 12 SMEs, 14 LEs and 12 RTOs, and covers the industrial value chains from simulations, sensors and components to packaging, integration and reliability as well as connectivity, cloud and cyber security solutions.


Aixacct Systems GmbH 148 227 €
Applied Materials Italia Srl 312 500 €
AT & S Austria Technologie & Systemtechnik AG 349 824 €
Beneq Oy 259 150 €
Besi Austria GmbH 392 375 €
Besi Netherlands B.V. 37 875 €
Canon Production Printing Netherlands B.V. 169 988 €
Consorzio Nazionale Interuniversitario Per LA Nanoelettronica 863 625 €
Csem Centre Suisse D'Electronique ET DE Microtechnique SA - Recherche ET Developpement 295 289 €
E + E Elektronik GmbH 123 250 €
Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. 275 727 €
Innosent GmbH 193 500 €
Lapin Ammattikorkeakoulu Oy 287 088 €
Luna Geber Engineering Srl 72 781 €
Materials Center Leoben Forschung GmbH 245 075 €
Nome Oy 90 813 €
Pac Tech - Packaging Technologies GmbH 173 375 €
Qplox Engineering 81 160 €
Quantavis Srl 215 000 €
Reden B.V. 79 111 €
Rigas Tehniska Universitate 119 009 €
SAF Tehnika AS 82 406 €
Sandvik Mining AND Construction Oy 55 040 €
Siec Badawcza Lukasiewicz - Instytut Mikroelektroniki i Fotoniki 204 750 €
Smartmotion s.r.o. 89 375 €
SSH Communications Security Oyj 278 685 €
Stichting Imec Nederland 215 110 €
Sylvac SA 197 104 €
Tampereen Korkeakoulusaatio sr 255 393 €
Technische Universitaet Chemnitz 126 597 €
Technische Universiteit Delft 209 484 €
Tipb Toegepaste Industriele Procesbeheersing 93 538 €
Tornos SA 51 601 €
Ujv Rez AS 155 503 €
Universita Degli Studi Di Perugia 0,00 €
Universita Di Pisa 0,00 €
Valmet Technologies Oy 184 445 €
Wurth Elektronik GmbH & Co. KG 89 700 €
Zapadoceska Univerzita V Plzni 196 359 €

https://cordis.europa.eu/project/id/876362

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