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Financement de l’UE (25,8 M €) : dont l’architecture donne lieu à deux autres générations de substrats et de technologies avancés entièrement épuisés Hor 01/05/2015 Programme de recherche et d'innovation de l'UE « Horizon »

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dont l’architecture donne lieu à deux autres générations de substrats et de technologies avancés entièrement épuisés

The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. The project represents the first phase of a 2 phase program aiming at establishing a 10nm FDSOI technology for 2018-19. A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and prepare next big wave of electronic devices. The consortium gathers a large group of partners: academics/institutes, equipment and substrate providers, semiconductor companies, a foundry, EDA providers, IP providers, fabless design houses, and a system manufacturer. E&M will contribute to the objective of installing a pilot line capable of manufacturing both advanced SOI substrates and FDSOI CMOS integrated circuits at 14nm and beyond. Design houses and electronics system manufacturer will provide demonstrator and enabling IP, to spread the FDSOI technology and establish it as a standard in term of leading edge energy efficient CMOS technology for a wide range of applications battery operated (consumer , healthcare, Internet of things) or not. Close collaboration between the design activities and the technology definition will tailor the PPAC trade-off of the next generation of technology to the applications needs.


Applied Materials France 60 519 €
Bruker AXS GmbH 694 160 €
Centre National de la Recherche Scientifique CNRS 594 996 €
Commissariat a L Energie Atomique et aux Energies Alternatives 13,8 M €
Dainippon Screen Deutschland GmbH 75 585 €
EV Group E. Thallner GmbH 534 464 €
FEI Electron Optics B.V. 259 899 €
Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. 1 289 579 €
Globalfoundries Dresden Module One LLC & Co. KG 244 805 €
Global Tcad Solutions GmbH 98 820 €
Gold Standard Simulations Ltd. 37 817 €
HQ-Dielectrics GmbH 98 628 €
Institut Polytechnique de Grenoble 64 526 €
ISD Lyseis Olokriromenon Systimatonanonymos Etaireia 132 234 €
LAM Research AG 0,00 €
LAM Research SAS 99 010 €
Muneda GmbH 113 442 €
Nokia Solutions AND Networks GmbH AND CO KG 66 375 €
Nova Ltd. 247 813 €
Picosun Oy 72 971 €
Prodrive Technologies B.V. 113 750 €
Siltronic AG 168 565 €
Socionext Europe GmbH 284 754 €
Soitec SA 3 777 541 €
Sony Deutschland GmbH 129 200 €
Stmicroelectronics Crolles 2 SAS 1 650 840 €
Stmicroelectronics France 708 502 €
Stmicroelectronics Grenoble 2 SAS 0,00 €
Synopsys (Northern Europe) Ltd. 67 483 €
Tokyo Electron Europe Ltd. 0,00 €
Unity Semiconductor GmbH 145 131 €
Universidad de Granada 48 750 €
Universite Catholique de Louvain 84 906 €

https://cordis.europa.eu/project/id/662175

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