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Financement de l’UE (8 403 155 €) : Emballage avancé pour la photonique, l’optique et l’électronique pour une fabrication à faible coût en Europe Hor01/05/2019 Programme de recherche et d'innovation de l'UE « Horizon »
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Emballage avancé pour la photonique, l’optique et l’électronique pour une fabrication à faible coût en Europe
The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufacturing and packaging value chain to Europe - or even start to bring it back. APPLAUSE supports this by building on the European expertise in advanced packaging and assembly to develop new tools, methods and processes for high volume mass manufacturing of electrical and optical components. The technologies will be piloted in 5 industrial Use Cases, related to 1. Substantially smaller 3D integrated ambient light sensor for mobile and wearable applications (AMS) 2. High performance, low cost, uncooled thermal IR sensor for automotive and surveillance applications (IDEAS) 3. High speed Datacom transceivers with reduced manufacturing costs (DustPhotonics) 4. Flexible cardiac monitoring patch and miniaturized cardiac implants with advanced monitoring capabilities (GE Healthcare and Cardiaccs). The APPLAUSE consortium is built of a number of leading experts from European electronics packaging companies representing different value chain levels related to advanced packaging and smart system integration. The parties have complementary expertise in conception, design, packaging, testing and manufacturing of electronic components, as well as a wide range of expertise from several different end use areas. The unique European ecosystem established within the consortium represents the competitive, leading edge of the technologies available.
https://cordis.europa.eu/project/id/826588
Cette annonce se réfère à une date antérieure et ne reflète pas nécessairement l’état actuel.
