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Financement de l’UE (4 959 450 €) : Assemblage de circuits imprimés miniaturisés à l’aide de poudres de soudure hyperfines à faible coût Hor 11/08/2015 Programme de recherche et d'innovation de l'UE « Horizon »
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Texte
Assemblage de circuits imprimés miniaturisés à l’aide de poudres de soudure hyperfines à faible coût
The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double component density will be achieved. Consequently, this would effectively enable more than a doubling of the functions available on electronic devices such as cell phones, satellite navigation systems, health devices etc. The successful completion of the FineSol project would lift the ultra-miniaturisation/functionality road block and also enable reduction in raw material usage, reduction in WEEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.
| Abis sp. z o.o. | 253 400 € |
| Applied Materials Italia Srl | 217 000 € |
| Atomising Systems Ltd. | 450 625 € |
| Center for Technology Research Andinnovation (Cetri) Ltd. | 400 750 € |
| Creative Nano PC | 196 700 € |
| Ektos Testing & Reliability Service AS | 440 410 € |
| Ethniko Kentro Erevnas Kai Technologikis Anaptyxis | 723 875 € |
| European Federation for Welding Joining AND Cutting | 207 563 € |
| Instituto de Soldadura e Qualidade | 443 338 € |
| MAT-Tech B.V. | 415 065 € |
| Microchip Technology Caldicot Ltd. | 333 375 € |
| Polmecanic Group sp. z o.o. | 265 475 € |
| Prisma Electronics SA | 242 375 € |
| Rise Research Institutes OF Sweden AB | 369 500 € |
https://cordis.europa.eu/project/id/680718
Cette annonce se réfère à une date antérieure et ne reflète pas nécessairement l’état actuel.
