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Financement de l’UE (14,5 M €) : Ligne pilote de capteurs FE/BE flexible pour l’Internet multidimensionnel Hor 01/05/2016 Programme de recherche et d'innovation de l'UE « Horizon »

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Ligne pilote de capteurs FE/BE flexible pour l’Internet multidimensionnel

The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and creator for answers to the challenges of the modern society. Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden and Regensburg) and one backend (Regensburg) lines networking with existing highly specialized manufacturing lines. Focus is the availability of top innovative, competitive sensors and sensor systems “Made in Europe” for applications in Smart Mobility, Society, Energy, Health and Production. Today competitors are already involved in the development of sensor systems for applications in the emerging “Internet of Things”. But there is a significant gap between those forces and the capabilities to bring ideas into the high volume market fast enough. IoSense will close this gap by providing three modular flexible pilot lines being seamless integrated in the IoT value crating networks and ready to manufacture each kind of sensor system prototypes. IoSense will increase the manufacturing capacity of sensor/MEMS components in the involved pilot lines by factor of 10 while reducing manufacturing cost and time by 30%. IoSense is designed to enable focused development work on technological and application oriented tasks combining with market orientation. “Design to Market Needs” will be accomplished by customer involvement, embedding all required functionality besides sensors. Finally, the time for idea-to-market for new sensor systems is intended to be brought down to less than one year. As a result, semiconductor manufacturing will get a new boost in Europe enabling the industry with competitive solutions, securing employment and providing answers to the upcoming challenges in the IoT era.


Advanced Packaging Center B.V. 187 063 €
Agencia Estatal Consejo Superior de Investigaciones Cientificas 230 642 €
AIT Austrian Institute OF Technology GmbH 490 858 €
AMS Netherlands B.V. 95 288 €
AMS-Osram AG 493 731 €
Andritz AG 45 563 €
Boschman Technologies B.V. 271 953 €
Centre Tecnologic de Telecomunicacions de Catalunya 342 214 €
DR. Fodisch Umweltmesstechnik AG 232 500 €
Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. 403 075 €
Fundacion Tecnalia Research & Innovation 221 165 €
Hochschule FUR Angewandte Wissenschaften Burgenland GmbH 128 500 €
IMA Materialforschung UND Anwendungstechnik GmbH 192 383 €
Infineon Technologies AG 1 929 139 €
Infineon Technologies Austria AG 1 488 964 €
Infineon Technologies Dresden AG & Co. KG 1 778 202 €
Integrasys SA 54 594 €
Interuniversitair Micro-Electronica Centrum 2 831 631 €
Iquadrat Informatica SL 156 250 €
Ixion Industry And Aerospace SL 151 781 €
Materials Center Leoben Forschung GmbH 348 292 €
Powertec s.r.o. 55 188 €
Siemens AG 0,00 €
Signify Netherlands B.V. 180 873 €
Silicon Austria Labs GmbH 156 857 €
Slovenska Technicka Univerzita V Bratislave 123 970 €
Technische Universitaet Dresden 267 700 €
Technische Universitaet Graz 223 689 €
Technische Universiteit Delft 449 168 €
Thales Alenia Space Espana SA 134 438 €
Universitaet Klagenfurt 190 838 €
Virtual Vehicle Research GmbH 325 600 €
Xenon Automatisierungstechnik GmbH 300 927 €

https://cordis.europa.eu/project/id/692480

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