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Financement de l’UE (26,8 M €) : Intégration pilote de la technologie des semi-conducteurs de 3 nm Hor 20/05/2019 Programme de recherche et d'innovation de l'UE « Horizon »

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Intégration pilote de la technologie des semi-conducteurs de 3 nm

The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable to deal with 3D structures, defects analysis, overlay and feature size evaluation. Each of these objectives will be achieved by cooperation between key European equipment developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KTI involved with their suppliers, involvement of a strong knowledge network based on Universities of Germany, Heidelberg University Hospital, and the Netherland, TU Delft and the University of Twente, complemented with key Technology Institutes such as imec and Fraunhofer. The project addresses Section 15 “Electronics Components & Systems Process Technology, Equipment, Materials and Manufacturing”, Major Challenge 4 “Maintaining world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and Major Challenge 1 “Developing advanced logic and memory technology for nanoscale integration and application-driven performance” of the ECSEL JU Annual Work Plan 2018. As set out in the Multi Annual Strategic Plan 2018, PIn3S addresses the ambition for the European Equipment & Manufacturing industry for advanced semiconductor technologies to lead the world in miniaturization by supplying new equipment and materials approximately two years ahead of introduction of volume production of advanced semiconductor manufacturers. With the results of the Pin3S project the consortium builds on realizing IC manufacturers to migrate to the 3nm Technology node which enables a class of new products which have more functionality, more performance and are more power efficient. As such it will form the bases for innovations yet to come enabling solutions that address the societal challenges in communication, mobility, health care, security, energy and safety & security.


Applied Materials Belgium 51 188 €
Applied Materials Israel Ltd. 1 001 150 €
Asml Berlin GmbH 1 422 688 €
Asml Netherlands B.V. 4 445 477 €
Carl Zeiss Microscopy GmbH 0,00 €
Carl Zeiss SMT GmbH 5 913 176 €
Coventor Sàrl 259 696 €
FEI Electron Optics B.V. 690 250 €
Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. 932 446 €
Interuniversitair Micro-Electronica Centrum 5 779 130 €
Ion Beam Services 265 795 €
KLA-Tencor Corporation (Israel) 1 508 325 €
KLA-Tencor MIE GmbH 0,00 €
LAM Research Belgium 0,00 €
Nova Ltd. 796 478 €
Pfeiffer Vacuum 196 909 €
Prodrive Technologies B.V. 828 750 €
Prodrive Technologies Innovation Services B.V. 0,00 €
Recif Technologies 99 109 €
Reden B.V. 79 828 €
Scia Systems GmbH 121 442 €
Sioux Technologies B.V. 703 931 €
Solmates B.V. 151 438 €
Technische Universiteit Delft 296 176 €
Universitatea Politehnica Din Bucuresti 0,00 €
Universiteit Twente 975 166 €
VDL ETG Technology & Development B.V. 233 870 €
VDL ETG Technology AND Development Hengelo B.V. 0,00 €

https://cordis.europa.eu/project/id/826422

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