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Financement de l’UE (6 463 827 €) : 3D Advanced Metrology and materials for advanced devices Hor01/04/2016 Programme de recherche et d'innovation de l'UE « Horizon »
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3D Advanced Metrology and materials for advanced devices
The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM will be a path-finding project which supports and complements several existing and future ECSEL pilot-line projects and is linked to the MASP area 7.1 (subsection More Moore). Innovative demonstrators and methodologies will be built and evaluated within the themes of metrology and characterization of 3D device architectures and new materials, across the full IC manufacturing cycle from Front to Back-End-Of-Line. 3D structural metrology and defect analysis techniques will be developed and correlated to address challenges around 3D CD, strain and crystal defects at the nm scale. 3D compositional analysis and electrical properties will be investigated with special attention to interfaces, alloys and 2D materials. The project will develop new workflows combining different technologies for more reliable and faster results; fit for use in future semiconductor processes. The consortium includes major European semiconductor equipment companies in the area of metrology and characterization. The link to future needs of the industry, as well as critical evaluation of concepts and demonstrators, is ensured by the participation of IMEC and LETI. The project will directly increase the competitiveness of the strong Europe-based semiconductor Equipment industry. Closely connected European IC manufacturers will benefit by accelerated R&D and process ramp-up. The project will generate technologies essential for future semiconductor processes and for the applications enabled by the new technology nodes.
| Adama Innovations Ltd. | 90 810 € |
| Applied Materials France | 15 718,75 € |
| APPLIED MATERIALS ISRAEL Ltd. | 740 625 € |
| ATTOLIGHT SA | 0,00 € |
| BRUKER AXS GmbH | 0,00 € |
| BRUKER TECHNOLOGIES Ltd. | 381 094 € |
| Cameca SAS | 344 563 € |
| Capres AS | 77 474 € |
| Commissariat a L Energie Atomique et aux Energies Alternatives | 525 063 € |
| Danmarks Tekniske Universitet | 191 259 € |
| FEI ELECTRON OPTICS B.V. | 1 110 813 € |
| FEI SAS | 207 500 € |
| Interuniversitair Micro-Electronica Centrum | 873 666 € |
| Jordan Valley Semiconductors UK Ltd. | 0,00 € |
| NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO | 628 813 € |
| NOVA Ltd. | 600 000 € |
| SEMILAB FELVEZETO FIZIKAI LABORATORIUM Zrt. | 531 250 € |
| Stmicroelectronics Crolles 2 SAS | 0,00 € |
| TECHNISCHE UNIVERSITEIT EINDHOVEN | 145 180 € |
https://cordis.europa.eu/project/id/692527
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