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Financement de l’UE (28,2 M €) : Avancées technologiques pour la ligne pilote de semi-conducteurs améliorés pour le 3 nm Hor 28/06/2018 Programme de recherche et d'innovation de l'UE « Horizon »

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Avancées technologiques pour la ligne pilote de semi-conducteurs améliorés pour le 3 nm

"In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to discover, develop and demonstrate lithographic, metrology, EUV mask technology, devices and process modules enabling 3nm node technology. This is planned with available EUV/NA 0.33 scanners, and with system design and integration of a new hyper NA EUV lithography tool to enable more single exposure patterning at 3nm to create complex integrated circuits. Process steps for 3D devices as alternative to the conventional FINFet will be explored for application in the 3nm node. The impact of the application of these so called 3D devices on circuit topology and logic design will be explored. During the development, specific challenges in metrology for the characterization of 3D devices will be assessed and metrology tools will be newly developed. The result will be demonstrated in the imec pilot line. The TAPES3 project relates to the ECSEL work program topic Equipment, Material and Manufacturing. It addresses and targets, as set out in MASP, the grand Challange of ""More Moore Equipment and Materials for sub 10nm technologies"" by exploring the requirements and solutions for the 3nm node. The project touches the core of the continuation of Moore’s law. Moreover, the cost aware development process will support the involved companies, and will place them in a preferred position over their worldwide competition. Through their worldwide affiliations, the impact of the TAPES3 project will be felt outside Europe in America and Asia Pacific semiconductor centers and is expected to benefit the European economy a lot by supporting its semiconductor equipment and metrology sectors with innovations, exports and employment."


Advanced Mask Technology Center GmbH & Co. KG 80 488 €
Applied Materials Belgium 71 562 €
Applied Materials Israel Ltd. 1 462 650 €
Asml Netherlands B.V. 7 577 677 €
Carl Zeiss SMT GmbH 4 156 250 €
Coventor Sàrl 358 803 €
Demcon Bunova B.V. 0,00 €
Demcon High-Tech Systems Enschede B.V. 0,00 €
Demcon Industrial Systems Groningen B.V. 0,00 €
Demcon Innovation & Technology B.V. 0,00 €
Demcon Life Sciences & Healtheindhoven B.V. 0,00 €
Demcon Life Sciences & Health Enschede B.V. 345 000 €
Demcon Production B.V. 0,00 €
FEI Electron Optics B.V. 845 012 €
Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. 387 050 €
Institut Fuer Mikroelektronik Stuttgart 867 464 €
Interuniversitair Micro-Electronica Centrum 7 371 530 €
Ion Beam Services 274 096 €
JSR Micro N.V. 92 061 €
KLA-Tencor Corporation (Israel) 346 185 €
LAM Research AG 0,00 €
LAM Research Belgium 0,00 €
Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO 634 375 €
Nova Ltd. 943 250 €
Optix FAB GmbH 168 438 €
Oxford Instruments Nanotechnology Tools Ltd. 29 736 €
Paul Scherrer Institut 134 952 €
Physikalisch-Technische Bundesanstalt 187 396 €
Recif Technologies 119 192 €
Rheinisch-Westfaelische Technische Hochschule Aachen 169 906 €
Siemens Electronic Design Automation Sàrl 0,00 €
Siemens Industry Software A Limitedliability Company Under THE Privatefree Zones Regime 0,00 €
Siemens Industry Software N.V. 183 675 €
Siltronic AG 457 088 €
Suss Microtec Solutions GmbH & Co. KG 37 500 €
VDL Enabling Technologies Group B.V. 0,00 €
VDL Enabling Technologies Group Eindhoven B.V. 0,00 €
VDL ETG Technology & Development B.V. 891 603 €

https://cordis.europa.eu/project/id/783247

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