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Financement de l’UE (22,9 M €) : European Consortium for Accelerating Innovations in Electronic Packaging Manufacturing Hor01/07/2025 Programme de recherche et d'innovation de l'UE « Horizon »
Vue d’ensemble
Texte
European Consortium for Accelerating Innovations in Electronic Packaging Manufacturing
"The Chips JU project E2PackMan contributes to strengthen innovation and packaging production in Europe to improve the ecosystem for leading edge / advanced electronics. Integration of more functionality in smaller volume is still the major driver in microelectronics. In order to facilitate further miniaturization, assembly and packaging (A&P) is becoming of increasing importance for the value chain of a microelectronic product. To secure the future of electronic products ""Made in Europe"", we need a big push to strengthen innovation and production in the A&P sector. Thus E2PackMan will push materials research as well as innovative equipment and process developments. The focus of this research will be on catalyzing industrial production capabilities in Europe, both strengthening the production capabilities of the large semiconductor suppliers in Europe and creating a network that enables SMEs to produce their innovative devices in Europe. A world-class consortium of 60 partners from 13 European countries has been brought together to push advanced packaging in Europe towards heterogeneous system integration: The E2PackMan -EU project tackles a coherent approach that includes the whole value chain from material, process and technology developments validated by test-builds including the interface of the package to the chips and to the board/system. "
https://cordis.europa.eu/project/id/101194187
Cette annonce se réfère à une date antérieure et ne reflète pas nécessairement l’état actuel. L’état actuel est présenté à la page suivante : Heraeus Electronics GmbH & Co. KG, Hanau, Allemagne.
