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Financement de l’UE (3 547 090 €) : PAS À PAS DE LITHOGRAPHIE HOLOGRAPHIQUE SUB-WAVELENGTH POUR LA PRODUCTION DE CIRCUITS INTEGRES Hor01/01/2024 Programme de recherche et d'innovation de l'UE « Horizon »
Vue d’ensemble
Texte
PAS À PAS DE LITHOGRAPHIE HOLOGRAPHIQUE SUB-WAVELENGTH POUR LA PRODUCTION DE CIRCUITS INTEGRES
To achieve ever shrinking dimensions and higher resolutions of circuit elements, projection lithography (PL), is growing in complexity and cost to manufacturers. It is limited to producing 2D images on flat surfaces. Extension to 3D imaging is restricted by trade-off between focus depth and resolution. Advanced, cost-efficient solutions to fabricate wafer-scale 3D components are required. HoLiSTEP unleashes the potential of sub-wavelength Holographic Lithography (HL) as a powerful and enabling disruptive lithography. HL will overcome limitations of PL and facilitate production of novel 3D topographies with high resolution while making the production of high-resolution IC much more affordable. An industrial prototype operating at 345nm with 200nm resolution will be produced and validated in an operational environment. Several advancements in holographic stepper subcomponents must be realised: A UV fibre-based laser with 20W output power at 345nm and 1.5m coherence length, an alignment system with 25nm overlay precision, an adaptive optical system with correction precision of 1/20λ and software modules for vector diffraction models. Energy consumption of HL technology is drastically reduced compared to PL due to low power-consumption of the laser and production of complex structures in one exposure. HL images are not sensitive to mask defects, eliminating frequent mask replacements and use of toxic materials. Moreover, holographic masks act as projection optics, eliminating the need for complex optical systems. The HL prototype will be verified for 3D patterning for MEMS, MOEMS and micro-optical components to show better resolution, flexibility of 3D printing and reduced cost. HoLiSTEP will empower a positive transformative effect on environment, economy and society by enabling a wider range of companies to produce novel high-resolution 2D and 3D images at lower costs.
| Mimotec SA | ? |
| Ampliconyx Oy | 338 170 € |
| Capgemini Engineering Deutschland SAS & Co. KG | 388 841 € |
| Ekspla UAB | 282 044 € |
| Flexible Optical B.V. | 445 624 € |
| Fraunhofer Gesellschaft ZUR Forderung DER Angewandten Forschung e. V. | 1 368 875 € |
| ITA-Suomen Yliopisto | 59 860 € |
| Tampereen Korkeakoulusaatio sr | 663 678 € |
https://cordis.europa.eu/project/id/101137624
Cette annonce se réfère à une date antérieure et ne reflète pas nécessairement l’état actuel. L’état actuel est présenté à la page suivante : Mimotec SA, Sion, Suisse.
